CHEMICAL MECHANICAL POLISHING TOOLS

HIGH FELXIBILITY AND PRODUCTIVITY FOR 200MM AND 300MM

EBARA's high throughput F*REX series CMP systems are running today's toughest applications such as oxide, ILD, STI, tungsten and copper for IC fabrication in addition to those challenges in the MEMS/SOI/Magnetic Media industries.

They feature exceptional reliability with a performance greater than 250 hrs MTBF. The F*REX200 and F*REX300SII platforms for 200 and 300 mm wafer diameters respectively provide state of the art design and performance to meet the most advanced device fabrication needs. They offer user oriented system configuration and are designed to allow for maximum throughput and all feature dry-in/dry-out wafer handling.

EBARA’s applications groups in Europe, Japan and Worldwide continue to drive the most advanced applications to be positioned at the leading edge of the industry´s production and new technology requirements.

F*REX200

PRODUCT DESCRIPTION

Based on nearly 100 years of experience with rotary equipment EBARA has perfected the planarization process with its F*REX200 series of polishers for 200 mm wafers.

As expected from EBARA systems the family members are designed to exceed today’s requirements on latest CMP processes for the most advanced application starting from standard STI, oxide, W and Cu up to latest high-k materials and aluminium layers along with the challenges posed by the emerging MEMS/SOI and Magnetic media markets.

The F*REX200 tool represents the latest CMP Technology adapted to 200 mm wafers (available as 150 mm as well). It features EBARA’s patented Dry-In/Dry-Out wafer handling technology. The cleaning modules are integrated within the CMP tool thus delivering dry wafers to subsequent processes.

The FREX200 system is equipped with 2 platens, 1 head per platen and 4 cleaning stations and optionally with 4 cassette SMIF compatible load ports and CIM host communication. Further options are End Pointing, Buffing Platens and Inline Metrology.

FEATURES AND OPTIONS

Modular layout:  
The complete modular design of the F*REX200 family offers a wide variety of possible process setups and enables fastest throughput as the wafer trace through the specific modules can be customized from process to process.

Polishing heads:
The F*REX200 can be equipped with all of EBARA’s different polishing heads to support all applications customized to specific needs. Available configurations start at standard heads with retainer ring to a multizone membrane head enabling all state-of-the-art CMP processes of the current semiconductor manufacturing landscape and beyond.

Slurry Flow Control:
The slurry can be delivered to the rotary tables by a slurry injection system which enables a constant slurry flow minimizing cost-of-ownership without compromises in process performance. Three slurry lines per table offer a wide range of possible process on one single tool. In the standard configuration with rotary pumps EBARA can offer various upgrades to ensure a constant slurry flow to the platen.

Up to three stages cleaning module:
The cleaning module consists of a sequence of brush cleaning and rinse stations enabling a minimum defectivity after CMP.

End-Point systems:
Application specific end point detection and monitoring systems ranging from turn table motor current over optical and eddy current measurement probes up to thin-film metrology with closed-loop-control are available and make the tools customizable to the maximum extend.

State-of-the-art communication protocols:
All tools of the F*REX200 support state-of-the-art SECS/GEM and HSMS communication protocols as well as EBARA specific communication protocols for tool health monitoring.

F*REX300SII

PRODUCT DESCRIPTION

Based on nearly 100 years of experience with rotary equipment EBARA has perfected the planarization process with its latest CMP product generation the F*REX300SII family for 300 mm wafers.

As expected from EBARA systems the family members are designed to exceed today’s requirements on latest CMP processes for the most advanced application starting from standard STI, oxide, W and Cu up to latest high-k materials and aluminium layers along with the challenges posed by the MEMS/SOI and Magnetic Media markets.

All tools of the F*REX300 family feature EBARA’s patented Dry-In/Dry-Out wafer handling technology. The cleaning modules are integrated within the CMP tool thus delivering dry wafers to subsequent processes.

The F*REX300SII is the latest in the line of the 300mm CMP Polishers and has taken its know-how from the widely used F*REX300 in this new generation of Polisher.

To enhance productivity and Cost-of-ownership the F*REX300SII has two more platens (4 in total), a layout which enables a variety of different parallel and serial polishing modes targeting Cu and other advanced applications. The layout enables a greater throughput especially for 2 step processes.

The F*REX300SII system is equipped with 1 head per platen and 3 cleaning stations and with 4 FOUP load ports. Further options include the latest Profile head technology, Pad thickness and retainer ring thickness monitoring, Endpoint monitoring and Inline metrology.

FEATURES AND OPTIONS

Modular layout:
The complete modular design of the F*REX300 family offers a wide variety of possible process setups and enables fastest throughput as the wafer trace through the specific modules can be customized from process to process.

Polishing heads:
All family members can be equipped with all of EBARA’s different polishing heads. The head configurations start with a standard version with retainer ring to a latest 3rd generation floating head with multiple zonal control. This variety of polishing heads enables the customization of the polishing tool towards all state of the art CMP application and beyond.

Slurry Flow Control:
The slurry can be delivered to the rotary tables by a slurry injection system which enables a constant slurry flow minimizing cost-of-ownership without compromises in process performance. Three slurry lines per table offer a wide range of possible process on one single tool. In the standard configuration with rotary pumps EBARA can offer various upgrades to ensure a constant slurry flow to the platen.

Up to three stages cleaning module:
The cleaning module consists of a sequence of brush and pencil cleaning and rinse stations enabling a minimum defectivity after CMP.

End-Point systems:
Application specific end point detection and monitoring systems ranging from turn table motor current over optical and eddy current measurement probes up to thin-film metrology with closed-loop-control are available and make the tools customizable to the maximum extend.

State-of-the-art communication protocols:
All tools of the F*REX300 family support state-of-the-art SECS/GEM and HSMS communication protocols as well as EBARA specific communication protocols for tool health monitoring.