| Chemical Mechanical Polishing (CMP) |  | EBARA's high throughput F*REX series CMP systems are running today's toughest applications such as oxide, ILD, STI, tungsten and copper. They feature the highest reliability with a performance greater than 250 h MTBF. The new F*REX200/300 for 200 and 300 mm wafer diameters provide state of the art design and process performance to meet advanced sub-micron device fabrication. They offer user oriented system configuration and are designed for high throughput of up to 50 wafers per hour. The system is equipped with 2 platens, 1 head per platen and 4 cleaning stations and optionally with 4 cassette SMIF compatible load ports and CIM host communication. Further option are End Pointing, Buffing Platens, Nova.
EBARA’s CMP systems feature dry-in/dry-out wafer handling and the integration of slurry supply, wafer cleaning units and waste disposal in one machine.
EBARA’s applications group in Japan continues to drive the most advanced applications to be positioned at the lead of the industry´s production and new technology requirements. | | F*REX 200 family
F*REX 300 family 
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| | EBARA Chemical Plating |  | One of the largest innovations in the semiconductor technology is the move from Aluminium to Copper as the material for the (scratch) interconnects in semiconductor devices. This move goes along with a move from dry to wet Metallisation techniques, i.e. the Damascene Process.
The EBARA chemical plating (ECP) system, developed for the Damascene Copper Metalisation process, was designed by merging the proven platform and cleaning performance of our CMP tool together with our technology in plating, which has continuously evolved since we entered the plating industry in 1968. The result is a copper plating system which exceeds today's application requirements while achieving throughputs as high as 60 to 80 wafers per hour. The ECP is compatible with seed and barrier deposition, either sputtered or deposited through CVD methods. The ECP series is available for wafer sizes of 200 and 300 mm. | | ECP 200
ECP 300 currently as used tool available | | | Ultra Fine Plating |  | The technological progress in the semiconductor industries results in faster and smaller IC's, that can perform even more functions than before. This ends in the necessity of smaller packages with higher densities and numbers of I/O's The use of those IC's for portable phones and multimedia devices requires low power consumption. To accommodate this, the use of new package designs and materials are needed. All these requirements are resulting in necessary innovations in packaging techniques for IC's.
Responding to these technological requirements and based on its experience in wet process technologies, EBARA Precision Machinery has introduced a new electroplating tool, the Ultra Fine Plating (UFP) series, that can be used in all "through mask plating processes", as used for redistribution and bumping in the wafer level packaging processes. The UFP series is designed for modular configuration and can easily be adopted to customer-specific processes. The system can be used for multi layer plating application consisting of Copper, Nickel and Solder or Gold. The systems are not only able to process 150, 200 and 300 mm wafers, but are also available in different levels of automation.
The high demands for "green" semiconductor production are also influencing the packaging processes. All over the world intensive investigation on "Lead-free" Solders are going on and Ebara Precision Machinery is proud being able to provide evaluated processes for Lead free bumping with our plating tools. | | UFP 200
UFP 300 
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