EBARA's EPO and high throughput F*REX series CMP systems are running today's toughest applications such as oxide, ILD, STI, tungsten and copper. They feature the highest reliability with a performance greater than 250 h MTBF. The new F*REX200/300 for 200 and 300 mm wafer diameters provide state of the art design and process performance to meet advanced sub-micron device fabrication. They offer user oriented system configuration and are designed for high throughput of up to 50 wafers per hour. The system is equipped with 2 platens, 1 head per platen and 4 cleaning stations and optionally with 4 cassette SMIF compatible load ports and CIM host communication. Further option are End pointing, Buffing platens, Nova.
EBARA’s CMP systems feature dry-in/dry-out wafer handling and the integration of slurry supply, wafer cleaning units and waste disposal in one machine.
EBARA’s applications group in Japan continues to drive the most advanced applications to be positioned at the lead of the industry´s production and new technology requirements. | | F*REX 200 family
F*REX 300 family 
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