| ECP Series |  |
One of the largest innovations in the semiconductor technology is the move from Aluminium to Copper as the material for the (scratch) interconnects in semiconductor devices. This move goes along with a move from dry to wet Metallisation techniques, i.e. the Damascene Process.
The EBARA chemical plating (ECP) system, developed for the Damascene Copper Metalisation process, was designed by merging the proven platform and cleaning performance of our CMP tool together with our technology in plating, which has continuously evolved since we entered the plating industry in 1968. The result is a copper plating system which exceeds today's application requirements while achieving throughputs as high as 60 to 80 wafers per hour. The ECP is compatible with seed and barrier deposition, either sputtered or deposited through CVD methods. The ECP series is available for wafer sizes of 200 and 300 mm. |
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ECP 200
ECP 300
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