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| The ECP 200 system is designed to fulfil the high demands of the copper damascene metal plating process for 200 mm wafers. Like our CMP systems, the ECP provides the confidence of guaranteed reliability, with performance of greater than 250 hours Mean Time Between Failure (MTBF) and less than 2 hours Mean Time To Repair (MTTR). The ECP offers the convenience of Dry In / Dry Out processing and integrated cleaning. | | | In addition to the tool itself, an automated electrolyte analyser, replenishment system and a waste treatment system are available. Combining Ebara's 30 years of plating experience with the chemistry know-how of Ebara's subsidiary Ebara Udylite, we are able to supply a specially formulated plating solution, which reduces plating over features and serving to reduce dishing, erosion and total wiring loss in the subsequent CMP process. |
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| Dry-in/Dry-out: | | The ECP200 is equipped with a fully automated load/unload station as a backbone for our manufacturing-proven dry-in/dry-out concept. | | | Plating Modules: | | The ECP 200 can be equipped with multiple plating modules, and can achieve a throughput in excess of 70 wph. | | | Cleaning: | | EBARA has developed an integrated module for etching the wafer edge/bevel and for cleaning the backside of the wafer. This cleaning step addresses copper cross contamination issues by exceeding today's requirements of copper ion density on the backside of the wafer. | | | Automated Solution Management System: | | Ebara's unique solution management system features fully automated online analyses of all inorganic components, the 3 organic components and includes a fully automated replenishment system for all chemicals. |
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