| Ultra Fine Plating (UFP) |  | The technological progress in the semiconductor industries results in faster and smaller ICs, that can perform even more functions than before. This ends in the necessity of smaller packages with higher densities and numbers of I/Os The use of those ICs for portable phones and multimedia devices requires low power consumption. To accommodate this, the use of new package designs and materials are needed. All these requirements are resulting in necessary innovations in packaging techniques for ICs.
Responding to these technological requirements and based on its experience in wet process technologies, EBARA Precision Machinery has introduced a new electroplating tool, the Ultra Fine Plating (UFP) series, that can be used in all "through mask plating processes", as used for redistribution and bumping in the wafer level packaging processes. The UFP series is designed for modular configuration and can easily be adopted to customer-specific processes. The system can be used for multi layer plating application consisting of Copper, Nickel and Solder or Gold. The systems are not only able to process 150, 200 and 300 mm wafers, but are also available in different levels of automation.
The high demands for "green" semiconductor production are also influencing the packaging processes. All over the world intensive investigation on "Lead-free" Solders are going on and EBARA Precision Machinery is proud being able to provide evaluated processes for Lead free bumping with our plating tools. | | UFP 200
UFP 300 
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