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| The UFP 300 series is designed to accommodate all applications of "Through mask plating" processes (also called "patterned plating"), such as redistribution plating and solder bump plating in advanced packaging applications, including wafer level Chip Scale Packaging. | | | The UFP 300 A system is a fully automated system for high volume production and accommodates 150 and 200 mm wafer sizes. The semi-automated system (UFP 300 S) offers manual wafer loading in combination with automated wafer transfer between cells , or a fully manual system (UFP 300 M) is available which can be used for small volume production or R&D purposes. | | | The UFP series can be equipped with different plating cell and bath combinations for sequential multiple-stack plating applications, so is easily customisable to fulfil our customers specific needs. |
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| Dry-in/Dry-out: | | The UFP 300 A is equipped with a fully automated load/unload station as a backbone for our manufacturing-proven dry-in/dry-out concept. | | | Plating Modules: | | The UFP 300 tool family is expandable to suit throughput requirements as well as for multiple metal applications. | | | Cleaning: | | The UFP series is equipped with post plating rinsing baths and the UFP 300 A has an additional Spin Rinse & Dry to ensure the plated wafer is completely clean and dry prior to re-introduction into the cassette. |
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