One step ahead

Ready to face the challenges of semiconductor miniaturization, 3D modelling and cost-cutting.

R&D

We invest heavily in Europe to expand our leading-edge technologies such as 3-D modelling. We are prepared for the future.

Disruptive

We engage in technologies such as IoT, Car, A/R, clouds, 5G and in innovative materials such as GaN, SIC and Saphire.

Enhancing

We constantly work on new technologies for CMP tools such as polishing and plating on 6‘‘ to 12‘‘ wafers.

Efficiency

Challenge in miniaturization

EBARA’s CMP systems enable 300-millimeter semiconductor
wafers to be miniaturized and made ultra-smooth, down
to the 10- to 20-nanometer level.

More information

Are you looking for a CMP solution?