Perfect plating.

We care about your wafer level packaging processes.

Enhanced mask plating.

The wafer plating systems enable fast, high performance processing for depositing fine conductive patterns on wafers. This includes bumps, pillars, re-wirings and through silicon via structures, which are essential for packaging techniques.

Ultra Fine Plating Systems

Semi and fully automated systems – the UFP300A or UFP300AD

Core Benefits

High throughput

Versatility

AI detection control

High efficiency

Cost and space saving

Compact solution

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Applications for UFP models

  • Redistribution
  • Bumping
  • IC advanced packaging
  • Wafer level chip packaging
  • Multi-layer applications
  • Patterned plating (copper, Nickel, Gold, solder)

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100% Peace of Mind
Best reliability in class. Best return on investment in class. 100% Peace of Mind