Enhanced mask plating.
The wafer plating systems enable fast, high performance processing for depositing fine conductive patterns on wafers. This includes bumps, pillars, re-wirings and through silicon via structures, which are essential for packaging techniques.
Ultra Fine Plating Systems
Semi and fully automated systems – the UFP300A or UFP300AD
Applications for UFP models
- IC advanced packaging
- Wafer level chip packaging
- Multi-layer applications
- Patterned plating (copper, Nickel, Gold, solder)