Leading technology

The champions – CMP tools for perfection in planarization processes

To be on top.

As a world market leader in CMP systems, we provide the semiconductor industry with state-of-the art design and performance to meet the most advanced fabrication demands such as perfect planarization technology for 200 mm and 300 mm wafer production.

Fast growing installation base – the F-REX200M2

The F-REX200M2 polishes 200 mm wafers with high k-materials and aluminium layers. Equipped with
user-oriented system configuration, the modular design is suitable for multiple process setups.

The best-in-class CMP tool – the F-REX300X

The F-REX300X polishes 300 mm wafers.  With four platens and a layout for different parallel and serial polishing modes
to target Cu and other advanced applications.

Core Benefits

High process performance

High volume manufacturing

Energy saving design concept

Customer specific options

High reliability

Experience in CMP since 1992

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Applications for F-REX

  • Oxide
  • ILD (interlevel dielectric)
  • STI (shallow trench isolation)
  • Tungsten
  • Copper for IC fabrication
  • MEMS
  • SOI (Silicon on insulator)
  • Magnetic Media

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100% Peace of Mind
Best reliability in class. Best return on investment in class. 100% Peace of Mind