To be on top.
As a world market leader in CMP systems, we provide the semiconductor industry with state-of-the art design and performance to meet the most advanced fabrication demands such as perfect planarization technology for 200 mm and 300 mm wafer production.
Fast growing installation base – the F-REX200M2
The F-REX200M2 polishes 200 mm wafers with high k-materials and aluminium layers. Equipped with
user-oriented system configuration, the modular design is suitable for multiple process setups.
The best-in-class CMP tool – the F-REX300X
The F-REX300X polishes 300 mm wafers. With four platens and a layout for different parallel and serial polishing modes
to target Cu and other advanced applications.
Applications for F-REX
- ILD (interlevel dielectric)
- STI (shallow trench isolation)
- Copper for IC fabrication
- SOI (Silicon on insulator)
- Magnetic Media