Advanced Packaging
Applying front-end technolgoy to back-end processes. Adressing the increased CMP and plating processes due to multi-layer writing in advanced packaging. Solutions for Panel Level Packaging (PLP) providing solutions for panel CMP and plating processes for large-area panels with high-density interconnect formation, supporting the advanced packaging market.
Processing
The highly serialized nature of wafer processing has increased the demand for more interconnected processing steps. This makes us your solutions partner. In addition to our components, we provide whole process expertise and the ability to run your systems. Contact us and request our expertise for the entire wafer process chain and processing techniques.
