ULTRA FINE PLATING

EBARA's ELECTROPLATING TOOLS UFP SERIES

The technological progress in the semiconductor industries results in faster and smaller ICs that can perform even more functions than before. This ends in the necessity of smaller packages with higher densities and numbers of I/Os The use of those ICs for portable phones and multimedia devices requires low power consumption. To accommodate this, the use of new package designs and materials are needed. All these requirements are resulting in necessary innovations in packaging techniques for ICs.

Responding to these technological requirements and based on its experience in wet process technologies, EBARA Precision Machinery has introduced a new electroplating tool, the Ultra Fine Plating (UFP) Series, that can be used in all "through mask plating processes", as used for redistribution and bumping in the wafer level packaging processes. The UFP series is designed for modular configuration and can easily be adapted to customer-specific processes. The system can be used for multi layer plating application consisting of Copper, Nickel and Solder or Gold. The systems are not only able to process 150, 200 and 300 mm wafers, but are also available in different levels of automation.

The UFP200 series is designed to accommodate all applications of "Through mask plating" processes (also called "patterned plating"), such as redistribution plating and solder bump plating in advanced packaging applications, including wafer level Chip Scale Packaging.The UFP200A system is a fully automated system for high volume production and accommodates 150 and 200 mm wafer sizes. The semi-automated system (UFP200 S) offers manual wafer loading in combination with automated wafer transfer between cells, or a fully manual system (UFP200M) is available which can be used for small volume production or R&D purposes.

The UFP series can be equipped with different plating cell and bath combinations for sequential multiple-stack plating applications, so is easily customisable to fulfil our customers specific needs.

FEATURES:

Dry-in/Dry-out:
The UFP200A is equipped with a fully automated load/unload station as a backbone for our manufacturing-proven dry-in/dry-out concept.

Plating Modules:
The UFP200 tool family is expandable to suit throughput requirements as well as for multiple metal applications.

Cleaning:
The UFP series is equipped with post plating rinsing baths and the UFP200A has an additional Spin Rinse & Dry to ensure the plated wafer is completely clean and dry prior to re-introduction into the cassette.

The UFP300 series is designed to accommodate all applications of "Through mask plating" processes (also calle "patterned plating"), such as redistribution plating and solder bump plating in advanced packaging applications, including wafer level Chip Scale Packaging.

The UFP300A system is a fully automated system for high volume production and accommodates 150 and 200 mm wafer sizes. The semi-automated system (UFP300S) offers manual wafer loading in combination with automated wafer transfer between cells , or a fully manual system (UFP300M) is available which can be used for small volume production or R&D purposes.

The UFP series can be equipped with different plating cell and bath combinations for sequential multiple-stack plating applications, so is easily customisable to fulfil our customers specific needs.

FEATURES:

Dry-in/Dry-out:
The UFP300A is equipped with a fully automated load/unload station as a backbone for our manufacturing-proven dry-in/dry-out concept.

Plating Modules:
The UFP300 tool family is expandable to suit throughput requirements as well as for multiple metal applications.

Cleaning:
The UFP series is equipped with post plating rinsing baths and the UFP 300 A has an additional Spin Rinse & Dry to ensure the plated wafer is completely clean and dry prior to re-introduction into the cassette.